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Relife RL-044 re-balling stencil for the CPU, NAND, Baseband, WI-FI, NFC, BGA for iPhone 7 to iPhone 13.
BGA stencil for re-balling the iPhone 7, 8, X, Xr, 11, 12 and 13 models.
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Relife RL-044 re-balling stencil for the CPU, NAND, Baseband, WI-FI, NFC, BGA for iPhone 7 to iPhone 13.
BGA stencil for re-balling the iPhone 7, 8, X, Xr, 11, 12 and 13 models.
Contains stencil for all IC.
| Compatible Model | iPhone 13, iPhone 13 mini, iPhone 13 Pro, iPhone 13 Pro Max |
|---|---|
| Product Type | Screens & Parts |
| Brand | Relife |
| Weight | 0.03 kg |
| Dimensions | N/A |
| SKU | 6941590205625 |
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Order before 4PM (Mon–Fri) for same-day dispatch, with tracked delivery across the globe.
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What Customers Say
“The RELIFE RL-044 BGA Re-Balling CPU NAND Baseband WI-FI Stencil Template For iPhone 7 to 13 arrived exactly as described and works perfectly. Fast dispatch too!”
AR
Ahmed R.
Verified Buyer
“We order the RELIFE RL-044 BGA Re-Balling CPU NAND Baseband WI-FI Stencil Template For iPhone 7 to 13 regularly for our shop — consistent quality every time.”
SK
Sarah K.
Repair Shop Owner
“Good value for the RELIFE RL-044 BGA Re-Balling CPU NAND Baseband WI-FI Stencil Template For iPhone 7 to 13. Exactly what I needed for the job, no complaints.”
DM
Daniel M.
Verified Buyer
“Ordered the RELIFE RL-044 BGA Re-Balling CPU NAND Baseband WI-FI Stencil Template For iPhone 7 to 13 and it was delivered faster than expected. Highly recommend.”
PS
Priya S.
Verified Buyer
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