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Silicone Thermal CPU Heatsink Compound Grease Paste
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Description
Thermal heatsink paste / grease used to fill the microscopic gaps between the surface of a CPU / processor or other components and its heatsink.
Improve the transfer of heat from the component to the heatsink, keep the component cool and prevent damage from overheating.
Paste is comprised of a mixture of silicone, metal oxide, or ceramic particles suspended in a grease-like substance.
..:: Specifications
- Type: Silicone Fluid with 20% Metal Oxide.
- Thermal conductivity: >1.829 W/m-k.
- Thermal resistance: >0.123 C-in2/w.
- Dielectric Breakdown: >5.0 KV ac.
- Weight: 41g.
- Size: 6.5″ x 1.5″(LxW).
- Paste Colour: Grey.
Specification
Overview
| Weight | 0.04 kg |
|---|---|
| Product Type | Computing |
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